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RAS

1100bII
1100c

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CES

eCES

ACE

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BSC

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SMC

PMC

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Ion Source

Computer System for Film Deposition

Formation

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Load Lock Type Sputter Thin Film Deposition Equipment
The RAS-1100BII is a sputter thin film deposition coater developed through our unique Radical Assisted Sputtering (RAS) technology, which enables high-quality thin optical films with no wavelength shift to be consistently produced at low temperatures. This medium-sized device can form functional films, including decorative and nitride films.
Features
Can produce high-density thin optical films with no wavelength shift
Supports low temperature formation of films for a range of applications
Allows production of sophisticated, thin optical films that meet strict design specifications simply by adjusting coating times
Combines high- and low-refractive index materials to enable consistent fabrication of films with a medium refractive index
Enables the formation of functional films, including nitride and decorative films
Load lock system enables formation of film with consistent quality
Compact design and more efficient film production reduce CO2 emissions to help care for the environment
Significantly reduces maintenance and cleaning workloads compared to conventional vapor deposition systems
Enables production of films with a growth area of approximately 1.0 m2 while limiting the variation in film deposit thickness to 0.5%
Automatic sputter control system enables automated sputtering
Significantly reduces maintenance and cleaning workloads compared to conventional vapor deposition systems
A workable lifter enables easy removal of substrate drum
Optional external adjusting mechanism for the correcting plate
System Configuration
Installed Baseboard Vertically-placed rotary drum
Optical Film Thickness Meter None
Crystalline Film Thickness Meter None
Computer System SSC-1
RAS Structure Sputter Source + Oxidation Reaction Source

Performance of Equipment
Evacuation Period (Film deposition room) Achieves 1~10-3Pa within 30 min. (under our measurement conditions)
Evacuation Period (Preprocess room) From atmospheric pressure to 7Pa within 7 min. (under our measurement conditions)
Achievable Vacuum Pressure 1~10-4Pa or less
Heating Temperature of Baseboard No heating
Thickness Distribution CV (Coefficient of Variance) = within 0.5% (under our delivery conditions)

Installation Requirements
Power Requirement Three-phase 200V}10% 68kW (Maximum Power)
Requirement of Coolant Approx. 140L/min. 18-24ºC (Standard: 20ºC)
Required Compressed Air 0.5MPa or more (up to 0.7MPa)
Installation Area W~D~H: 4300mm ~ 6300mm ~ 2700mm (requires 3000mm-high ceiling)
Gross Weight Approx. 9000kg

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* The product specifications may be modified for improved performance without any notice.
For details, please contact our sales division.
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