A load lock type sputter thin film deposition equipment with the proprietary Radical Assisted Sputtering (RAS) method. This equipment achieves the steady deposition of high-density and wavelength-shift-free thin film.

An IAD-type vacuum thin film deposition equipment developed as the result of a thorough review of all aspects of the system.
This product achieves the reduction of the evacuation period, baseboard heating period and film deposition period, the improvement of the reproducibility of film and operability, downsizing and weight reduction.