Load Loack Type Sputter Thin Film Deposition Equipment RAS-1100BII
The RAS-1100BII is a sputter thin film deposition coater developed through our unique Radical Assisted Sputtering (RAS) technology, which enables high-quality thin optical films with no wavelength shift to be consistently produced at low temperatures. This medium-sized device can form functional films, including decorative and nitride films.
Features
- Can produce high-density thin optical films with no wavelength shift
- Supports low temperature formation of films for a range of applications
- Allows production of sophisticated, thin optical films that meet strict design specifications simply by adjusting coating times
- Combines high- and low-refractive index materials to enable consistent fabrication of films with a medium refractive index
- Enables the formation of functional films, including nitride and decorative films
- Load lock system enables formation of film with consistent quality
- Compact design and more efficient film production reduce CO2 emissions to help care for the environment
- Significantly reduces maintenance and cleaning workloads compared to conventional vapor deposition systems
- Enables production of films with a growth area of approximately 1.0 m2 while limiting the variation in film deposit thickness to 0.5%
- Automatic sputter control system enables automated sputtering
- Significantly reduces maintenance and cleaning workloads compared to conventional vapor deposition systems
- A workable lifter enables easy removal of substrate drum
- Optional external adjusting mechanism for the correcting plate
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System Configuration
| Installed Baseboard | Vertically-placed rotary drum |
|---|---|
| Optical Film Thickness Meter | Optional |
| Crystalline Film Thickness Meter | None |
| Computer System | SSC-1 |
| RAS Structure | Sputter Source + Oxidation Reaction Source |
| Rotary Cathode | Optional |
| Additional Targets | Optional (for chamber 1, single plate only) |
| High-vacuum Evacuation System | Optional (for chamber 1 only) |
Performance of Equipment
| Evacuation Period (Film deposition room) | Achieves 1×10-3Pa within 30 min. (under our measurement conditions) |
|---|---|
| Evacuation Period (Preprocess room) | From atmospheric pressure to 7Pa within 7 min. (under our measurement conditions) |
| Achievable Vacuum Pressure | 1×10-4Pa or less |
| Heating Temperature of Baseboard | No heating |
| Thickness Distribution | CV (Coefficient of Variance) = within 0.5% (under our delivery conditions) |
Installation Requirements
| Power Requirement | Three-phase 200V±10% 68kW (Maximum Power) |
|---|---|
| Requirement of Coolant | Approx. 140L/min. 18-24ºC (Standard: 20ºC) |
| Required Compressed Air | 0.5MPa or more (up to 0.7MPa) |
| Installation Area | W×D×H: 4300mm × 6300mm × 2700mm (requires 3000mm-high ceiling) |
| Gross Weight | Approx. 9000kg |
* The product specifications may be modified for improved performance without any notice.
For details, please contact our sales division.
