Compact multi-target sputtering system for research and development
The highest-level sputtering system for material search
- Application:
- Electron and electricity control
This is the PRAS (Programmable-RAS) compact multi-target sputtering system for research and development, using DPDRS (Digitally Processed DC Reactive Sputtering) technology that enables multiple control of multi-target spattering sources based on a programmable digital controller that we developed independently.
Combining the multitarget sputtering source and reactive gas in a programmable way achieved the deposition of composite metal compound multi-layered thin films, through time-shared rapid-reactive DC sputtering.
The unprecedented reactive DC pulse sputtering accelerates the development of nanostructured functional thin films at atomic layer levels.
Features
- Programmable time-shared rapid-reactive sputtering method
- Enables the deposition of multi-layer films at multicomponent atomic layer levels
- Simple and compact design driven by a voltage of 100 V
Specification outline
| System configuration | Film deposition chamber, spare chamber, and automatic substrate transfer |
|---|---|
| Substrate table | 2” (Up to 4”), 20 rpm, up/down travel distance of 20 mm |
| Cathode | 2” (Up to four cathodes) |
| Gas introduction | Sputtering gas (Ar) and reaction gases (O2 and N2) |
| Substrate heating | Carbon heater (Up to 600°C) |
| Power requirements | 1f 100 V +/- 10% 4 kW (Maximum) |
| Floor space | W 1,500 mm x D 900 mm x H 1,400 mm |
| Total weight | 450Kg |
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your requirements for functions
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* Product specifications are subject to change for performance improvement without prior notice. For details, please contact our sales representatives.