Sputtering system for large substrates
The latest model that achieves the highest productivity among RAS series systems
- Application:
- Surface controlColor control
This system was developed for the purpose of achieving the highest productivity in the history of RAS series systems.
As an increase in drum size and a reduction in system size were realized simultaneously, this system is excellent in area productivity.
RAS-2200 takes full advantage of our RAS technology cultivated up to now to provide the world of optical thin films with new benefits.
Features
- Employing a large-sized drum enabled the increase of substrate loading quantity as well as the deposition of films on large substrates
- The load lock-type substrate holder transfer method that we developed independently enables the maximum elimination of redundant takt time
- Adding the resistance heating deposition source achieved the integrated deposition of antireflection and antifouling films
- Films can be deposited on curved substrates
- The compact system design enhanced the maintainability
Major applications
- Antireflection films, rigid films, decorative films, various types of optical filters, and so on
- Cover glasses for displays employed in in-car devices and smartphones
- Cover glasses for cameras employed in smartphones
Specification outline
Substrate drum size | ⌀ 1,800 x 1,500 mm |
---|---|
Radical source | ICP RF radical source x 3 |
Sputtering source | Dual cathode 68” rotary cathode |
Exhaust system | [CH-1] Roughing unit [CH-2] 14-inch TMP x 6, Meissner trap, and roughing unit |
Option | AFS mechanism: CH-2, and substrate heating mechanism: CH-1 |
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your requirements for functions
and applications.
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* Product specifications are subject to change for performance improvement without prior notice. For details, please contact our sales representatives.