Load lock type sputtering system for dielectric multilayer films
RAS method that Shincron developed independently achieves superior productivity and stability
- Application:
- OpticsSurface controlColor control
The RAS (Radical Assisted Sputtering) method that Shincron developed independently enables the deposition of high-density optical thin films with no wavelength shift, functional thin films including decorative films, nitride films, and so on with high reproducibility.
In addition, as this system can deposit films at low temperatures, it enables the deposition of multi-layer films on resin substrates.
Features
- Enables the deposition of high-density optical thin films with no wavelength shift
- Applicable to a wide range of applications because films can be deposited at low temperatures
- Enables high-precision control of film composition and thickness, and realizes functional films that cannot be formed through evaporation
- Mixed films made of both highly and lowly refractive materials enable the deposition of intermediate refractive-index films with high reproducibility
- Designed to reduce the burden of maintenance and cleaning works
- A countermeasure is taken against particles generated during exhaustion and processes
- Equipped with an operation management system that can be used to grasp conditions on a real-time basis and analyze losses
Major applications
- Deposition of optical thin films
- Deposition of metallic films
- Also responds to a wide variety of applications
Specification outline
Model | RAS-1100C | RAS-1100BⅡ | RAS-1600plus |
---|---|---|---|
Substrate drum size | ⌀ 1,100 mm x 230mm | ⌀ 900 mm x 400mm | ⌀ 1,400 mm x 910mm |
Radical source | ICP RF power source | ICP RF power source x 2 | |
Sputtering source | Dual cathode, 18” x 5” planer cathode | Dual cathode, 27” x 5” planer cathode | Dual cathode, 47” x 5” planer cathode |
Exhaust system | [CH-1] Roughing unit [CH-2] 14-inch TMP x 2 Meissner trap Roughing unit |
[CH-1] Roughing unit [CH-2] 14-inch TMP x 4 Meissner trap Roughing unit |
|
Option | OPM-Z1 / rotary cathode / CH-1 target / CH-1 AFS mechanism / CH-1 high-vacuum exhaust system / planetary rotation substrate drum |
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* Product specifications are subject to change for performance improvement without prior notice. For details, please contact our sales representatives.